Balancer of temperature compensating type, movement of a timepiece, mechanical timepiece and method

专利摘要:
A temperature compensated rocker includes a rocker shaft (41) that rotates about an axis of rotation (O), and a rocker wheel (42) having a plurality of bi-material portions (50). which are subsequently disposed in a circumferential direction about the axis of rotation (O) and extend in an arcuate manner along the circumferential direction about the axis of rotation (O), and connecting members (51) radially connecting each of the bi-material portions (50) to the balance shaft (41), wherein the bi-material portion (50) is a multilayer body including a first member (60) and a second element (61), radially more outwardly than the first element (60), overlap one another radially, one end of which in the circumferential direction is a fixed end (50A) connected to the connecting element ( 51) and whose other end in the circumferential direction is a free end (50B), the first element (60) is made of a material selected from a ceramic, silicon (Si), silicon carbide (SiC), silicon dioxide (SiO 2) , sapphire, alumina (Al 2 O 3), zirconia (ZrO 2), vitreous carbon (C) and a metal, especially Invar, and the second element (61) is made of a metal having a coefficient of thermal expansion different from that of the material of the first element (60). The invention also relates to a method of manufacturing such a balance and a movement and a timepiece comprising such a balance.
公开号:CH707630B1
申请号:CH00272/14
申请日:2014-02-25
公开日:2019-04-15
发明作者:Niwa Takashi；Nakajima Masahiro；Kawauchiya Takuma；Fujieda Hisashi；Shinke Manabu
申请人:Seiko Instr Inc；
IPC主号:

专利说明:

Description
BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a temperature-compensated balance wheel, a timepiece movement, a mechanical timepiece and a manufacturing method of the invention. balance with temperature compensation. 2. Description of the Prior Art [0002] A regulator for a mechanical timepiece is generally constituted so as to comprise a balance and a spring. Such a balance is an element that oscillates by rotating cyclically in one direction and then in the opposite direction about an axis of a balance shaft, and it is important that its oscillation cycle is set in a setting value predetermined. Indeed, the running of the mechanical timepiece (value indicating whether the timepiece is fast or slow) varies if the oscillation cycle out of the setting value. However, the oscillation cycle is likely to vary due to different causes, and for example, it also varies due to a change in temperature.
Here, a ring oscillation cycle T described above is expressed by the following equation (1).
In equation (1), the moment of inertia of the balance is the letter I and the stiffness of the spiral spring is the letter K. Therefore, if the moment of inertia of the balance or the stiffness of the spiral spring varies, the oscillation cycle also varies.
Here, a metal used for the balance is generally a material whose linear expansion coefficient is positive and which expands due to an increase in temperature. As a result, the balance wheel is widened radially to increase the moment of inertia. In addition, since the Young's modulus of a steel which is generally used for the spiral spring has a negative temperature coefficient, an increase in temperature causes the stiffness to decrease.
As described above, in case of increase in temperature, the moment of inertia increases accordingly and the stiffness of the spiral spring decreases. Therefore, as shown in Equation (1) described above, the pendulum swing cycle has the characteristic of being shorter at low temperature and longer at high temperature. For this reason, as a temperature characteristic of the timepiece, the timepiece is fast at low temperature and slow at high temperature.
Therefore, in order to improve the temperature characteristics of the pendulum swing cycle, the following two methods are known.
In the first known method, instead of giving the balance wheel the circular shape of a completely closed loop, the balance wheel is divided so as to be made of arc-shaped parts, and each of arc-shaped parts is a bimetallic part where metal plates made of materials with different thermal expansion coefficients of each other are radially bonded together, thereby adjusting the arcuate portions of which one end in the circumferential direction is a fixed end and the other end in the circumferential direction is a free end (see JP-B-43-26 014 (Patent Document 1)).
Generally, as described above, the balance wheel is enlarged radially due to expansion during an increase in temperature, which increases the effective moment of inertia. However, according to the first method, during an increase in temperature, the arc-shaped bimetal portions are deformed inwardly to move the free end side radially inward, due to a difference in the coefficient of thermal expansion. This allows an average diameter of the balance wheel to be reduced radially and allows the effective moment of inertia to be reduced. Therefore, it is possible to bring the temperature characteristics of the moment of inertia to a negative slope. Therefore, it is possible to change the moment of inertia in order to counterbalance an effect of the temperature on the spiral spring, which allows the oscillation cycle of the balance to be less dependent on the temperature.
The second method is a method in which a temperature coefficient of the Young's modulus in the vicinity of a range of operating temperature (for example, 23 ° C ± 15 ° C) of the timepiece is made to have positive characteristics by employing a constant elastic material such as Coelinvar as the material of the spiral spring.
According to this second method, in the operating temperature range, it is possible to cancel the change affecting the moment of inertia of the balance depending on the temperature by offsetting the coefficient of
linear expansion of the balance wheel and the linear expansion coefficient of the spiral spring, which allows the oscillation cycle of the balance to be less dependent on the temperature.
Incidentally, in the first method described above, the arcuate bimetal portions are formed by bonding the metal plates radially inwardly and the metal plates radially outwardly having a coefficient of expansion. different from each other, and as an example of a bonding process, there is brazing and crimping. However, in these processes, the finish depends on a bonding condition and the like so that it is difficult to ensure a constant accuracy on the shape. Moreover, since the arc-shaped portions are in the form of two metal plates, when brazing and crimping are completed, or when each of the arc-shaped portions is made by cutting, it is possible that the two metal plates are elastically deformed.
For these reasons, it is difficult to finish the bow-shaped bimetal parts by obtaining a high precision on their shape, and therefore, the adjustment of the inertial moment and the adjustment of a degree of temperature compensation are likely not to be stable. In addition, an iron based material such as invar (low thermal expansion material) is generally employed as a material for the radially inwardly disposed metal plate, and this leads to a rust generation problem unless veneer and the like are not carried out. As a result, manufacturing requires work, leaving room for improvement.
In addition, in the second method described above, there is the possibility that when the manufacture of the spiral spring uses a constant elastic material such as Coelinvar, a temperature coefficient of Young's modulus can vary greatly depending on the composition. during a melting process and different manufacturing conditions during a heat treatment process or the like. Therefore, a strict manufacturing control procedure is required, thereby not facilitating the production of the spiral spring. Consequently, in some cases, it is difficult to obtain that the temperature coefficient of the Young's modulus is positive in the vicinity of the operating temperature range of the timepiece. SUMMARY OF THE INVENTION [0015] The present invention is realized in view of such a context, and an object thereof is to provide a temperature compensation balance which is excellent in terms of shape accuracy, can be Stably manufactured with respect to the expected temperature correction work, is not prone to rust and can be efficiently manufactured while suppressing unnecessary external force (voltage) applied thereto; and a timepiece movement including it; a mechanical timepiece and a method of manufacturing the temperature compensated balance. The present invention provides a pendulum according to claim 1 for solving the above problems.
(1) The temperature compensation balance according to the present invention comprises a balance shaft which rotates about an axis of rotation, and a balance wheel which has a plurality of bi-material parts and elements connection which radially connect each of the plurality of bi-material portions to the balance shaft. The bi-material portions are subsequently disposed in a circumferential direction about the axis of rotation and extend in an arcuate manner along the circumferential direction about the axis of rotation. The bi-material part is a multilayer body of which a first element and a second element, radially more outwardly than the first element, overlap in radially succeeding succession, one end of which in the circumferential direction is a fixed end connected to the connecting element and whose other end in the circumferential direction is a free end. The first element may in particular be made of a ceramic. The second element is made of a metal having a coefficient of thermal expansion different from that of the first element.
According to the temperature compensation balance of the invention, if a temperature is changed, the bi-material part is curved radially and deformed with the fixed end as a starting point, because of a difference in coefficient of thermal expansion between the first element and the second element, which allows the free end of the bi-material part to move radially inwards or outwards. In this way, it is possible to change a position of the free end of the bi-material part in a radial direction. This allows the average diameter of the balance wheel to be reduced radially or increased, and thus, it is possible to change the moment of inertia for the overall balancing by changing the distance from the axis of rotation of the wheel. 'balance shaft. As a result, a slope of the temperature characteristics relating to the moment of inertia can be changed, and therefore, it is possible to perform a temperature correction.
When the first element of the bi-material portion is made of a ceramic, it is possible to prevent the bi-material portion is elastically deformed, and therefore, even if the free end repeats the fact of deforming due to the temperature correction, it is possible to realize a bi-material part having a stable accuracy over time.
As described above, since the bi-material portion can be formed with excellent accuracy in shape to prevent elastic deformation, temperature correction work can be stably performed as desired, and so that It is possible to produce a high-quality balance which is not liable to vary as to a rate depending on the temperature change and which is excellent in terms of temperature compensation.
In addition, the shape of the bi-material part can be adjusted, thereby allowing greater freedom in choosing the shape of the bi-material part. For example, the amount of temperature compensation can be adjusted by increasing a displacement. In addition, the first element is made of ceramic material, thus not likely to rust, even if a veneer is not performed. Accordingly, there is no need for a plating step, which allows the first element to be efficiently manufactured.
In addition, in the bi-material part comprising the first element and the second element which overlap radially with each other, since the first inner-side element is formed of a ceramic material, a thermal deformation of the first element caused by the temperature change is suppressed, so that the deformation of the bi-material part that is associated with the temperature change is suppressed to be low, and it is possible to obtain a desired amount of adjustment on the moment inertia. In other words, since the inner side element of the bi-material part is made of ceramic material and not of metal, it is possible to design a quantity of deformation of the free end of the bi-material part without considering too much amount of thermal deformation of the inner side element.
As a result, the temperature correction with the moment of inertia can be easily performed, which improves the accuracy of the correction.
(2) In the temperature compensation balance according to the invention, it is preferable that the first element and the connection element are in one piece with each other being made of silicon on of ceramic, and the second element is an electroformed part made of metal having the thermal expansion coefficient different from that of the first element.
When the connecting element and the first constituent element of the bi-material part in the balance wheel are in one piece with each other being made of silicon, for example, it is possible forming the connecting element and the first element integrally with one another with excellent shape accuracy from a silicon substrate using semiconductor manufacturing technology (including a photolithography technique and an erosion treatment technology). Moreover, the use of semiconductor manufacturing technology allows the connection element and the first element to be formed into a desired minute shape without the application of unnecessary external force. Meanwhile, the second element forming the bi-material part is the electroformed part, thereby being able to bond to the first element by means of easy work simply to distribute the metal by electroforming molding. Therefore, unlike a brazing or crimping method as in the prior art, still without applying unnecessary external force to the first element, the second element can be bonded thereto. Therefore, in addition to preventing elastic deformation of the bi-material portion, it is possible to form the bi-material portion with excellent shape accuracy.
(3) In the temperature compensated balance according to the invention, it is preferable that the second element has a second securing portion which is secured to a first securing part formed in the first element, and that the one of the first and second securing parts enters the other securing part among these first and second securing parts so as to reinforce the connection between the first and second elements.
When this is the case, the bonding force between the first element and the second element can be improved by the joining of the first securing portion and the second securing portion, which allows an operational reliability of the bi-material part is improved. In addition, the securing between the two securing parts determines a position of the second element in the circumferential direction relative to the first element, so that the second element can be connected to a zone led by the first element. In this respect also, it is possible to improve operational reliability as the bi-material part.
(4) In the temperature compensation balance according to the invention, it is preferable that the first element and the second element are connected by means of an alloy layer.
When this is the case, the first element and the second element are bonded by the alloy layer, so that it is possible to improve the bond strength between the two elements, and it is possible to improve operational reliability as the bi-material part.
In the temperature compensation balance according to the invention, it is preferable that a flyweight is provided at the free end of the bi-material portion.
When this is the case, the mass of the free end of the bi-material portion can be increased by the weight, so that for a certain displacement of the free end in the radial direction, it is possible to perform the temperature correction more effectively with the moment of inertia. Therefore, the temperature compensation capability can be further improved.
(5) In the temperature compensation balance according to the invention, it is preferable that the first element and the connection element are made of a material chosen from Si, SiC, SiO 2, Al 2 O 3, ZrO 2 and C .
When this is the case, as a material selected from Si, SiC, SiO 2, Al 2 O 3, ZrO 2 or C is used, thereby allowing the etching process, in particular allowing the dry etching process to be preferably executed. Therefore, it is possible to form the connecting member and the first member more easily and more efficiently, thereby providing opportunities to further improve manufacturing efficiency.
(6) In the temperature compensated balance according to the invention, it is preferable that the second element is made of a material selected from Au, Cu, Ni, an alloy of Ni, Sn and a Sn alloy. .
When this is the case, when the metal material Au, Cu, Ni, Ni alloy, Sn or Sn alloy is used, it is possible to distribute the metal smoothly by electroforming molding and to effectively form the second element. Therefore, it is possible to further improve manufacturing efficiency.
(7) In the temperature compensation balance according to the present invention, it is preferable that the bi-material portion becomes gradually thinner in thickness along the radial direction from the fixed end region to the free end region.
When this is the case, since the bi-material part gradually becomes thinner in thickness along the radial direction when one goes from the fixed end side to the free end side, the bi-material part is prone to warping when going from the fixed end side towards the free end side. Specifically, when going towards the free end side, the bi-material portion deforms so as to be tilted radially. Therefore, an amount of variation in the radial direction (hereinafter simply referred to as a radius variation amount) of the free end side of the bi-material portion becomes significant compared to the amount of radius variation on the side. fixed end. As a result, the amount of radius variation on the free end side can be increased while maintaining the thickness of the fixed end side. Thus, it is possible to ensure the intensity first and ensure the necessary amount of temperature correction of the moment of inertia.
Therefore, it is possible to prevent the bi-material portion from being elastically deformed or damaged by shock and stably performing a temperature correction work as desired, and thus, it is possible to provide a high-quality balance that is not likely to vary with respect to a rate depending on the temperature change and which is excellent in terms of temperature compensation.
(8) In the temperature compensation balance according to the invention, the first element may be arranged radially more inwardly than the second element and be in one piece with the connection element being made silicon or ceramic. At least the first element of the first element and the second element may become gradually thinner along the radial direction from the fixed end side to the free end side.
When this is the case, the balance can be manufactured by a semiconductor manufacturing technology such as a photolithography technique by forming the connection element and the first element with silicon. In this case, compared to the case where the connection element or the first element would be made by means of a mechanical process, a high precision balance with a high degree of freedom of shape can be proposed. In addition, it is possible to form the connecting member and the first member more easily and more efficiently, thereby providing opportunities to further improve manufacturing efficiency.
Then, since at least the first element among the first element and the second element is formed so as to be gradually finer by going from the fixed end towards the free end, even in a case of manufacture. of the first element using silicon or a ceramic which is a brittle material, it is possible to first ensure the intensity on the fixed end side and to ensure the amount of variation in radius.
(9) In the temperature compensation balance according to the invention, the ratio of the thickness of the first element in the radial direction to the thickness of the second element in the radial direction can be constant from the region of fixed end up to the free end region.
When this is the case, a degree of deformation of the first element and the second element becomes uniform from the fixed end to the free end on the basis of the coefficient of thermal expansion and Young's modulus. In other words, it is possible to prevent the degree of deformation depending on a difference in the thickness ratio from being altered. Therefore, it is possible to stably deform the bi-material part, and a length of the bi-material part along the circumferential direction has the possibility of being set according to the amount of temperature correction required of the moment of inertia.
(10) In the temperature compensation balance according to the invention, a flyweight can be provided at the free end of the bi-material portion.
When this is the case, since the mass of the free end of the bi-material portion can be increased by the weight, compared to the amount of variation in radius of the free end, it is possible to perform more effectively the temperature correction of the moment of inertia. Therefore, the temperature compensation capability can be further improved.
(11) A timepiece movement according to the invention includes, firstly, a movement barrel which has a source of energy, secondly, a cog wheel which transfers a rotational force of the movement barrel, thirdly , an escapement mechanism which controls the rotations of the wheel of the wheel and, fourthly, a regulating mechanism provided to adjust the rate of the exhaust mechanism, the regulating mechanism comprising a temperature-compensated balance according to the invention.
The timepiece movement according to the invention is provided with the temperature compensation balance having the high temperature compensation capacity as described above, so that it is possible to provide a movement of the workpiece of high quality timepieces with few errors affecting its frequency.
(12) A mechanical timepiece according to the invention includes the movement of a timepiece according to the invention.
The mechanical timepiece according to the invention is provided with the timepiece movement described above, so that it is possible to propose a high quality mechanical timepiece having few errors affecting the frequency.
[0050] (13) A manufacturing method according to the invention is a manufacturing method of the balance with temperature compensation. It comprises an etching step, an electroforming molding step and a removing step. In the etching step, by etching after photolithography mask placement, a semi-finished piece is made from a substrate made of a material such as a ceramic material so as to include the first elements, the elements connection and a molding guide wall and that the first elements are connected to the connection elements, that the molding guide wall and one of the first elements delimit between them an open molding space and that the wall of molding guide is connected to this first element. In the electroforming molding step, a metal accumulates in the open molding space, on the semi-finished part, by electroforming molding, so as to form the second element and so that the bi part is obtained. -material in which the first element and the second element overlap radially succeeding each other and are linked. In the removal step, the molding guide wall is removed from the first member.
In the manufacturing method of the temperature compensated rocker according to the invention, it is possible to achieve the actuating effect similar to the temperature compensation balance described above. In other words, since the bi-material portion can be formed with excellent shape accuracy while avoiding elastic deformation, it is possible to stably perform the temperature correction work as desired. Therefore, it is possible to provide a high quality balance that is not likely to vary in frequency as a function of temperature change and is excellent in terms of temperature compensation capability.
Particularly, at the time of the step of manufacturing the substrate, in addition to the connection element and the first element, the semi-finished part is formed to which the molding guide wall is connected to be integrated. Therefore, the open molding space defined between the molding guide wall and the first element can be formed with excellent shape accuracy. Then, at the time of the electroforming molding step, the second element is formed by growing the metal in the open molding space, allowing the second element to be formed with excellent shape accuracy. As a result, it is possible to obtain the high quality bi-material part having a desired shape. In this way, it is possible to more clearly produce the adjustment effect described above.
(14) In the method of manufacturing the temperature compensation balance according to the invention, it is preferable that there is further a heat treatment step in which the semi-finished part having the bi-material part formed therein is heat-treated for a predetermined time in a predetermined temperature environment after the electroforming molding step.
When this is the case, since the heat treatment is performed after the formation of the bi-material part by connecting the second element to the first element by means of electroforming molding, it is possible to deposit the metal forming the second element. which is the electroformed portion along a bonding interface with respect to the first element, and thus, it is possible to form the alloy layer between the first element and the second element using this deposit. In this way, the first element and the second element can be bonded to each other by the alloy layer, which allows the bond strength of the two elements to be improved. Therefore, it is possible to improve operational reliability as the bi-material part.
According to the present invention, it is possible to provide a temperature compensation balance which is excellent in terms of precision on the form, can operate stably in the temperature correction work as desired, is not inclined to rust, can be manufactured efficiently while eliminating the application of an unnecessary external force (stresses), and having improved temperature compensation capability.
Brief description of the drawings [0056]
Fig. 1 illustrates an embodiment according to the present invention and is a configuration diagram of a movement of a mechanical timepiece.
Fig. 2 is a perspective view of a balance (balance with temperature compensation) configuring the movement illustrated in FIG. 1.
Fig. 3 is a sectional view taken along the line A-A illustrated in FIG. 2.
Fig. 4 is a perspective view of a balance wheel constituting the balance shown in FIG. 2.
Fig. 5 is a sectional view taken along the line B-B illustrated in FIG. 4.
Fig. 6 is a view of the process at the time of manufacture of the balance wheel shown in FIG. 4, and is a sectional view illustrating a state where a silicon oxide film is formed on a silicon substrate.
Fig. 7 is a sectional view illustrating a state where an arcuate groove portion is formed on the silicon oxide film from the state shown in FIG. 6.
Fig. 8 is a perspective view and illustrates the same state as FIG. 7.
Fig. 9 is a sectional view illustrating a state where a masking structure is formed on the silicon oxide film from the state shown in FIG. 7.
Fig. 10 is a perspective view illustrating the same state as FIG. 9.
Fig. 11 is a view from above which illustrates the same state as FIG. 9.
Fig. 12 is a sectional view illustrating a state with the masking structure as a mask and with the silicon oxide film selectively removed from the state illustrated in FIG. 9.
Fig. 13 is a perspective view illustrating the same state as FIG. 12.
Fig. 14 is a sectional view illustrating a state with the masking structure and the silicon oxide film as a mask and with a selective removal of the silicon substrate, from the state illustrated in FIG. 12.
Fig. 15 is a perspective view which illustrates the same state as FIG. 14.
Fig. 16 is a sectional view illustrating a state where the masking structure is removed and a semi-finished part is formed from the state shown in FIG. 14.
Fig. 17 is a perspective view illustrating the same state as FIG. 16.
Fig. 18 is a sectional view illustrating a subsequent state where the semi-finished part illustrated in FIG. 16 is born born and is glued on an adhesion layer of a first support substrate.
Fig. 19 is a perspective view illustrating the same state as FIG. 18.
Fig. 20 is a sectional view illustrating a state where there is a build-up of gold in an open molding space of the semi-finished part, by electroforming molding, and the formation of a second element, from the state illustrated in FIG. 18.
Fig. 21 is a perspective view illustrating the same state as FIG. 20.
Fig. 22 is a sectional view illustrating a state where, from the state illustrated in FIG. 20, the semi-finished piece is detached from the first support substrate, is turned over again, and then adhered to the adhesion layer of a second support substrate.
Fig. 23 is a sectional view illustrating a state where a molding guide wall is removed from the state illustrated in FIG. 22.
Fig. 24 is a perspective view illustrating a state where the second support substrate is detached from the state shown in FIG. 23.
Fig. 25 is a sectional view illustrating a state where the silicon oxide film is removed from the state shown in FIG. 24.
Fig. 26 is a perspective view illustrating the same state as FIG. 25.
Fig. 27 is a perspective view illustrating an example of modification of the balance wheel according to the invention.
Fig. 28 is a perspective view illustrating an example of modification of the balance according to the invention.
Fig. 29 is a top view, enlarged, and shows a bi-material portion of the balance shown in FIG. 28.
Fig. 30 is a perspective view illustrating another example of modification of the balance according to the invention.
Fig. 31 is another view from above, enlarged, and shows a bi-material part of the balance shown in FIG. 30.
Fig. 32 illustrates an example of a combination of a material of the first element and a material of the second element which form the bi-material part according to the invention and illustrates the most appropriate temperature for a heat treatment in each combination.
Fig. 33 is an enlarged plan view of a bi-material portion.
Fig. 34 is a graph showing the variation of a radius AR (mm) as a function of an angle θ (deg) relating to the bi-material part.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS [0057] Hereinafter, an embodiment according to the present invention will be described with reference to the drawings.
Configuration of mechanical timepiece, timepiece movement and balance with temperature compensation As illustrated in FIG. 1, a mechanical timepiece 1 according to the present embodiment is a watch or the like, and is configured to include a movement (timepiece movement) 10 and a housing (not shown) which receives the movement 10 .
Movement Configuration [0059] The movement 10 comprises a main plate 11. A dial (not shown) is arranged on a rear side of the main plate 11. A gear wheel inserted on a front side of the movement 10 is called a wheel. front wheel 28 and a gear wheel inserted on a rear side of the movement 10 is called a rear wheel.
A winding stem guide hole 11a is formed in the main plate 11 and a winding stem 12 is rotatably inserted therein. The winding stem 12 has a position determined axially by a switching device having an adjusting lever 13, a rocker 14, a rocker spring 15 and a jumper lever setting 16. In addition, a winding pinion 17 is rotatably disposed in a guide axis of the winding stem 12.
In such a configuration, for example, if the winding stem 12 is turned into a state where the winding stem 12 is located in a first winding stem position (zero step) closest to an inner side of the movement 10 in the direction of the axis of rotation, the winding pinion 17 is rotated via the rotation of a sliding pinion (not shown). Then, if the winding pinion 17 is rotated, a crown wheel 20 meshing with it is rotated. Then, if the crown wheel 20 is rotated, a ratchet wheel 21 meshing with it is rotated. In addition, if the ratchet wheel 21 is rotated, a main spring (energy source, not shown) received in a movement barrel 22 is wound.
The front wheel 28 of the movement 10 is configured not only to include the movement barrel 22, but also a center mobile 25, a third mobile 26 and a second mobile 27, and it performs a transfer function of the rotational force of the movement barrel 22. In addition, an escapement mechanism 30 and a speed control mechanism 31, each controlling the rotation of the front wheel 28, are arranged on the front side of the movement 10.
The center mobile 25 meshes with the movement cylinder 22. The third mobile 26 meshes with the center mobile 25. The second mobile 27 meshes with the third mobile 26.
The exhaust mechanism 30 is a mechanism controlling the rotation of the front wheel 28 described above and includes an escape wheel 35 meshing with the second mobile 27 and includes a pallet fork 36 bringing the wheel exhaust 35 to escape to be rotated regularly.
The speed control mechanism 31 is a mechanism regulating a speed of the exhaust mechanism 30 and includes a rocker (balance with temperature compensation) 40.
Configuration of the balance [0066] As illustrated in FIGS. 2 and 3, the rocker 40 includes a balance shaft 41 rotating (rotates) about an axis (axis of rotation) O, a rocker wheel 42 secured to the rocker shaft 41 and a spiral spring ( balance spring) 43. The rocker 40 is a member rotating in one direction and in the opposite direction about the axis O with a constant oscillation cycle by the energy transmitted from the spiral spring 43.
In the embodiment, a direction orthogonal to the axis O is called a radial direction and a direction rotating about the axis O is called a circumferential direction.
The rocker shaft 41 is a shaft body which extends vertically along the axis O, and an upper end and a lower end are pivotally supported by an element such as a main plate. or a balance bridge (none shown) configuring the movement 10. A substantially intermediate portion of the balance shaft 41 in the vertical direction is a large diameter portion 41a having the widest diameter. Further, in the balance shaft 41, a cylindrical double plate 45 is externally mounted and coaxial with the axis O on a portion positioned below the wide diameter portion 41a. The double plate 45 has an annular portion 45a projecting radially outwardly, and a pulse pin 46 for oscillation of the pallet fork 36 is attached to the portion 45a.
For example, the spiral spring 43 is a flat spiral spring which is wound spirally in a single plane, and its inner end is fixed to a portion positioned above the large diameter portion 41a in the balance shaft 41 by a collar 47. Then, the spiral spring 43 plays a role of storing the energy transmitted from the second mobile 27 to the escape wheel 35 and transmitting the energy to the balance wheel 42 as described above.
The spiral spring 43 of the embodiment is formed of an ordinary steel material having a temperature coefficient with the negative Young's modulus and a characteristic of this spiral spring 43 is that the spring stiffness is lowered by a temperature increase.
As illustrated in FIGS. 4 and 5, the rocker wheel 42 includes three bi-material portions 50 which are disposed about the axis O of the rocker shaft 41 along the circumferential direction and a connecting member 51 which connects respectively and radially. to these three bi-material parts 50 and to the balance shaft 41.
The connecting element 51 is arranged coaxially with the axis O and includes a circular connection plate 55 which has a central hole 55a formed at its center, a connecting ring 56 which surrounds the plate. circular connection 55 being spaced apart from outside in the radial direction and three connecting bridges 57 connecting an outer periphery portion of the circular connecting plate 55 and an inner periphery portion of the connecting ring 56 .
Then, the connecting element 51 is fixed to the large-diameter portion 41a of the rocker shaft 41 by the axle hole 55a, by tight fitting for example, being attached in this way to be integrated. relative to the balance shaft 41.
An outer periphery portion of the connecting ring 56 has three support projections 58 which protrude radially outwardly. These three support projections 58 are uniformly spaced apart with a constant gap in the circumferential direction. Further, in each of the support projections 58, a tilting surface 58a is formed which is gradually tilted towards one side (direction of the arrow T illustrated in Fig. 4) in the circumferential direction as being radially inclined. outside from the outer periphery portion of the connecting ring 56.
The connecting bridge 57 is an element that radially connects the circular connection plate 55 and the connecting ring 56 and is uniformly spaced with a constant gap along the circumferential direction. In the illustrated example, three of the connecting bridges 57 and three of the support projections 58 are arranged with an offset between them in the circumferential direction. However, the arrangement is not limited to this case.
The bi-material portion 50 is a multilayer body in which a first element 60 positioned radially inwardly and a second element 61 positioned radially outwardly of the first element 60 overlap each other and radially to be bonded to it. one to another. The bi-material portion 50 is formed in a belt shape extending in an arcuate shape along the circumferential direction. Then, the bi-material portion 50 is disposed in a state where the connecting ring 56 is provided with a radially outward gap and arranged along the circumferential direction, and only one end in the circumferential direction is a fixed end 50A connected to the connection element 51.
Specifically, the fixed end 50A of the bi-material portion 50 is connected to an opposite surface of the tilting surface 58a in the circumferential direction in the support projection 58 projecting from the connecting ring 56. Next the bi-material portion 50 extends from the support projection 58 in the direction of the arrow T along the circumferential direction. In this way, three bi-material portions 50 are arranged uniformly in the circumferential direction.
In addition, the other end of the bi-material portion 50 in the circumferential direction is a free end 50B which is radially displaceable due to a bending deformation caused by a change in temperature. The free end 50B is formed primarily of the first member 60 and shaped to be wider radially than the other portions of the bi-material portion 50, projecting radially inwardly.
In this way, the free end 50B is designed to have a larger mass than the other parts of the bi-material portion 50. In addition, a weight hole 62 is formed in the free end 50B of the mode. embodiment, and a flyweight 65 (refer to Figs 2 and 3) is attached in the weight hole 62 by tight fit for example. Therefore, the free end 50B is designed to be sufficiently heavier than the other parts within the bi-material portion 50 in that the weight of the flyweight 65 is provided therein.
As illustrated in FIGS. 2 and 3, the weight 65 is illustrated in a case where a rod 65a which is inserted into the weight hole 62 and a head 65b which is exposed on an upper surface of the free end 50B are formed to form a rivet.
In addition, as illustrated in FIG. 4, a portion of the radially inwardly facing free end 50B opposes the tilting surface 58a of the support projection 58, and in this manner is an opposite tilting surface 66 which is tilted with a tilting of the surface tipping 58a.
Incidentally, as illustrated in FIGS. 4 and 5, the bi-material portion described above 50 is formed by radially covering the first member 60 and the second member 61 to be in layers, and these members are formed of materials having different thermal expansion coefficients; the other.
Specifically in the embodiment, the first radially inwardly positioned member 60 is formed of silicon which is a low thermal expansion material.
Meanwhile, the radially outwardly positioned second member 61 is a high thermal expansion material whose thermal expansion coefficient is higher than that of the first member 60, and is made of a metal for electroform molding. , gold (Au) being used in the embodiment.
Therefore, as the temperature increases, the second member 61 expands more thermally than the first member 60, and thus, the bi-material portion 50 is bent and deformed to cause the free end 50B to move. radially inwardly with the fixed end 50A as a starting point.
In addition, the first member 60 of the embodiment is formed to be integral with the connection member 51. Therefore, similar to the first member 60, the connection member 51 is also made of silicon. That is to say, in the rocker wheel 42 configuring the rocker 40, the connection element 51 and the first element 60 are made of silicon, and only the second element 61 is made of gold.
Moreover, this second element 61 is a part formed by electroforming molding and is closely related to the first element 60 during the process of deposition of gold by electroforming molding. In addition, at both ends of the second element 61 in the circumferential direction, a V-shaped wedge (second securing portion) 67 in a plan view is provided which gradually extends in the circumferential direction radially to the interior as to be bonded to a concave V-shaped portion (first securing portion) 68 in a plan view which is formed on the side of the first member 60 in a state of engagement with.
In this way, the second element 61 is linked so as to be positioned relative to the first element 60 in the circumferential direction. Method of Temperature Correction [0088] Next, a temperature correction method with the moment of inertia with the balance 40 will be described.
According to the pendulum 40 of the embodiment, as illustrated in FIG. 2, if the temperature is changed, the bi-material portion 50 is radially curved and deformed with the fixed end 50A as a starting point, due to a difference between the coefficient of thermal expansion of the first member 60 and the coefficient of thermal expansion of the second member 61, thereby allowing the free end 50B of the bi-material portion 50 to move radially inward or outwardly. In other words, as the temperature increases, the bi-material portion 50 is bent and deformed radially inward, thereby allowing the free end 50B to move radially inwardly. When the temperature drops, the free end 50B can instead move radially outwards.
Therefore, it is possible to reduce radially or widen an average diameter of the rocker wheel 42, and therefore, it is possible to change the inertial moment for the general balancing 40 by changing a distance from the O axis of the balance shaft 41. In other words, when the temperature increases, the average diameter of the balance wheel 42 is reduced radially so that the moment of inertia is decreased. When the temperature drops, the average diameter of the rocker wheel 42 increases radially so that the moment of inertia is increased. In this way, it is possible to change a slope of the temperature characteristics from the moment of inertia to a negative slope. Therefore, it is possible to perform the temperature correction.
In other words, even if it is provided with the spiral spring 43 of which the Young's modulus has the negative temperature coefficient, at the time of the increase in temperature, the moment of inertia can be reduced simultaneously. with a decrease in the Young's modulus of the spiral spring 43, and therefore, it is possible to maintain the oscillation cycle of the balance 40 in a constant manner. Therefore, it is possible to perform the temperature correction. In addition, at the time of a drop in temperature, the moment of inertia can be increased simultaneously with an increase in the Young's modulus of the spiral spring 43, and therefore it is still possible to maintain the oscillation cycle in a constant manner. Therefore, it is possible to perform the temperature correction.
Here, additional features of the temperature correction method will be described in FIGS. 33 and 34. As illustrated in FIG. 33, in the bi-material portion 50 according to the embodiment, a thickness T-ι of a portion positioned on the fixed end 50A side along the radial direction is thick compared to a thickness T2 of a portion positioned on the free end 50B side, and the bi-material portion 50 gradually becomes thinner going from the fixed end side 50A towards the free end side 50B in its entirety.
In the embodiment, each thickness of the first member 60 and the second member 61 which are described above gradually becomes thinner going from the fixed end side 50A towards the free end side 50B. In the illustrated example, in the first member 60, a thickness of the portion positioned on the fixed end 50A side is Su and a thickness of the portion positioned on the free end side 50B is S21 (Su> S21). Further, in the second member 61, a thickness of the fixed end side portion 50A is S-2 and a thickness of the free end side portion 50B is S22 (S12> S22). .
In addition, in the bi-material portion 50, the ratio of the thickness of the first member 60 to the thickness of the second member 61 at the same location along the circumferential direction is uniformly adjusted at one end. to the other of the bi-material portion 50 in the circumferential direction. In this case, for example, the thickness ratio (Su to S12) at the fixed end 50A and the thickness ratio (S2i to S22) at the free end 50B are set to be equal ( refer to the following Equation (2).
If the Young's modulus of the first element 60 is ΕΊ, and the Young's modulus of the second element 61 is E2, it is preferable that the ratio of the thickness S-ι (for example, Su, S12) of the first member 60 on the thickness S2 (for example, S21, S22) of the second member 61 at the same location along the circumferential direction in the bi-material portion 50 is adjusted to satisfy Equation (3). In this way, the amount of deformation in the radial direction at an arbitrary position of the bi-material portion 50 along the circumferential direction can be increased.
FIG. 34 is a graph representing a quantity of variation of the radius AR (mm) as a function of the angle θ (deg) in the bi-material part 50.
In a central angle around the axis O, the angle θ having a straight line as reference line (O deg.) Connecting the fixed end 50A and the axis O in the bi-material portion 50 is an angle formed by an arc from the reference line to an arbitrary position of the bi-material portion 50 along the circumferential direction. Further, at an arbitrary position of the bi-material portion 50 along the circumferential direction, the amount of change affecting the radius AR is a radial component in the direction of the O axis out of the change vectors (e.g., ΗΊ , H2) which are from an initial position (continuous line on the drawing) to a changed position (center line on the drawing). In the graph shown in fig. 34, the bi-material portion 50 described above of the embodiment is shown in solid lines, and the bi-material portion 50 extending from the fixed end 50A toward the free end 50B to the same thickness as the Fixed end 50A (e.g., T-ι) of the embodiment is shown in dotted lines as a comparison example.
Here, as illustrated in FIGS. 33 and 34, according to the embodiment, since the thickness of the bi-material portion 50 gradually becomes thinner going from the fixed end side 50A to the free end side 50B so as to be susceptible of being bent and deformed by going from the fixed end side 50A to the free end side 50B. Specifically, at the time of the temperature increase, the bi-material portion 50 deforms so as to be tilted radially inward towards the free end side 50B. Therefore, a change amount affecting the radius AR2 of the free end side 50B (e.g. center of the weight 65) of the bi-material portion 50 becomes large compared to a change amount affecting a radius AR-i of the fixed end side 50A.
Accordingly, in the bi-material portion 50 of the embodiment, it is understood that the amount of change affecting a radius AR2 of the free end side 50B can be increased compared to the comparative example while maintaining the the thickness of the fixed end side 50A.
In addition, according to the embodiment, since the change vector H2 of the free end 50B is oriented in the direction of the axis O in accordance with the temperature change, in other words, since the bi-part material 50 deforms as to be rolled toward the axis O from a tip end side where the free end 50B is present, it is possible to increase the amount of change affecting an AR radius compared to a case where it would be in uniform thickness. Therefore, it is possible to effectively provide the amount of change affecting a radius AR2 in a limited arc length of the bi-material portion 50.
In this way, according to the pendulum 40 of the embodiment, since the bi-material portion 50 gradually becomes thinner from the fixed end side 50A to the free end side 50B, it is possible to ensure the amount of change in a radius AR2 on the free end side 50B while providing the thickness on the fixed end side 50A. Therefore, it is possible to first ensure the intensity of the bi-material portion 50 and to provide the amount of temperature correction required of the moment of inertia.
As a result, it is possible to prevent the bi-material portion 50 from being elastically deformed or damaged by shock and stably performing a temperature correction work as intended. and therefore, it is possible to provide a high quality balance 40 which is not likely to vary in a rate influenced by the temperature change and which is excellent in terms of temperature compensation capability.
In particular, in the embodiment, the rocker 40 can be made by a semiconductor manufacturing technology such as a photolithography technique by forming the connection element 51 and the first element 60 using silicon. In this case, compared to a case of manufacturing the connection element 51 or the first element 60 by a mechanical treatment, a high precision balance 40 having a high degree of freedom in the form can be provided. In addition, since it is possible to form the connecting member 51 and the first member 60 more easily and more effectively, it is also capable of improving manufacturing efficiency.
Then, since at least the first element 60 between the first element 60 and the second element 61 is gradually formed finer than it is from the fixed end side 50A towards the fixed end side 50B even in a case of forming the first element 60 using silicon which is a brittle material, it is possible to first ensure the intensity on the fixed end side 50A and to ensure the amount of change of the radius .
Moreover, since the thickness ratio of the first element 60 and the second element 61 in the radial direction is uniform from the fixed end side 50A to the free end 50B, a degree of deformation of the first element 60 and the second element 61 becomes uniform from the fixed end 50A to the free end 50B on the basis of the coefficient of thermal expansion and Young's moduli ΕΊ and E2. In other words, it is possible to prevent the degree of deformation influenced by a difference in the thickness ratio from being deviated. Therefore, it is possible to stably deform the bi-material portion 50, and a length of the bi-material portion 50 along the circumferential direction can be adjusted depending on the amount of temperature correction required from the moment of rotation. 'inertia.
Method of manufacturing a pendulum Then, a manufacturing method of the balance 40 will be described with reference to the drawings.
The method of manufacturing the balance 40 includes a step of manufacturing the balance shaft 41, a step of manufacturing the balance wheel 42, a step of manufacturing the spiral spring 43 and a step for combining the shaft the balance wheel 41, the balance wheel 42 and the spiral spring 43 to be integrated with each other. Here, the step of manufacturing the balance wheel 42 will be described in detail.
[0108] First, as illustrated in FIG. 6, after preparing a silicon substrate 70 which becomes the connecting member 51 and the first member 60 thereafter, a silicon oxide (SiO2) film 71 is formed on its front surface. At this time, the silicon substrate 70 thicker than the balance wheel 42 is used. In addition, the silicon oxide film 71 is formed by a process such as the plasma chemical vapor deposition (PCVD) method or thermal oxidation, for example.
In order to simplify the description herein, a case will be described as an example in which only one of the rocker wheels 42 is fabricated from the square shaped silicon substrate 70 in a plan view. However, a plurality of balance wheels 42 may be manufactured simultaneously, by preparing a platelet-shaped silicon substrate.
Then, as illustrated in FIGS. 7 and 8, a portion of the silicon oxide film 71 is selectively removed by etching, and three arcuate groove portions 72 are formed to be arranged by being spaced apart with an interval in the circumferential direction. The groove portions 72 are grooves for the formation of a molding guide wall 70A which is to be subsequently formed and shaped to be positioned more radially outward than the second member 61.
Then, as illustrated in FIGS. 9 to 11, after the formation of a photoresist in an inward region surrounded by three of the groove portions 72 on the silicon oxide film 71, the photoresist is patterned to form masking structures 73. At this time, the masking structure 73 is formed to have a configuration comprising a masking structure main body 73A which is patterned along the shape of the connection member 51 and the first element 60 and comprising a pattern 73B for the molding guide wall which is inserted into each of the three groove portions 72 and of which two ends in the circumferential direction are connected to the masking structure 73.
The photoresist can be formed by a common process such as spin coating and spray coating. In addition, the masking structure 73 may be formed by modeling the photoresist by the common method such as a photolithography technique.
Then, as illustrated in FIGS. 12 and 13, in the silicon oxide film 71, an area that is not masked by the masking structure 73 is selectively removed. Specifically, the silicon oxide film 71 is removed by wet etching employing an aqueous solution of hydrofluoric acid or by the dry etching process such as reactive ion etching (RIE).
In this way, it is possible to leave the silicon oxide film 71 only under the masking structure 73, thereby allowing the silicon oxide film 71 to be shaped into a shape along the masking structure 73.
Then, as illustrated in FIGS. 14 and 15, in the silicon substrate 70, the area that is not masked by the masking structure 73 and the silicon oxide film 71 is selectively removed. Specifically, the silicon substrate 70 is removed by etching operation which is a dry etch such as deep reactive ion etching (DRIE).
In this way, it is possible to leave the silicon substrate 70 only under the masking structure 73 and the silicon oxide film 71, thereby allowing the silicon substrate 70 to be shaped into a shape. along the masking structure 73.
Particularly, in the patterned silicon substrate 70, the portion remaining under the pattern 73B for a molding guide wall functions as the molding guide wall 70A.
Then, as illustrated in Figures 16 and 17, the masking structure 73 which is used as a mask is deleted. As a removal method, for example, dry etching by fuming nitric acid and dry etching employing an oxygen plasma can be illustrated.
According to the steps described above, the silicon substrate 70 is processed by the semiconductor technology so that three of the first elements 60 are connected to the connection element 51 to integrate with this, and the piece Semi-finished 75 can be obtained in which the molding guide wall 70A which defines an open molding space S between itself and each of the first elements 60 is connected to each of the first elements 60 to be integrated with them (accordingly each of the steps described above configures the processing step for the substrate of the invention).
After the formation of the semi-finished part 75, the second element 61 is formed by depositing gold in the open molding space S, by electroforming molding, and the electroforming molding step is carried out to form the bi-material portion 50 in which the first member 60 and the second member 61 are bonded to each other. The electroforming molding step will be specifically described.
First, as illustrated in Figures 18 and 19, after the preparation of a first support substrate 80 to which an adhesive layer 80C is bonded, for example by an electrode layer 80B on a main body substrate 80A, the semi-finished part 75 is turned upside down to urge the shaped silicon oxide film 71 to be laminated to the adhesive layer 80C. In the illustrated example, the semi-finished part 75 and the first support substrate 80 are glued together to the extent that the silicon oxide film 71 is integrated within the adhesive layer 80C.
[0122] There is no particular limit for the adhesion layer 80C. However, it is preferable to use photoresist for example. In this case, the photoresist is stuck in a pasty state, and then the photoresist can be processed until the photoresist is no longer in the pasty state.
Then, after the bonding has been performed, as shown in FIG. 18, in the adhesive layer 80C, portions that communicate with the open molding space S of the semi-finished part 75 are selectively removed. In this way, it is possible to expose the electrode layer 80B within the open molding space S.
At this moment, for example, when the adhesive layer 80C is the photoresist, it is possible to easily perform the selective deletion work by the photolithography technique.
Then, as illustrated in FIGS. 20 and 21, the electroforming molding is carried out using the electrode layer 80B, the gold gradually settling from the electrode layer 80B into the open space S molding, the interior of the open molding space S is filled, and then, an electroformed portion 81 is generated to the extent that the open molding space S fills. Then, this electroformed portion 81 is ground to be in a single surface with the semi-finished part 75. This allows the electroformed portion 81 to be the second element 61, and thus, it is possible to form the bi-material part. 50 in which the first element 60 and the second element 61 are connected to each other.
In performing the grinding, the silicon substrate 70 of the semi-finished part 75 can be ground at the same time.
At this stage, the electroforming molding step is terminated. In Figs. 20 and 21, an illustration of the general configuration elements (electroform molding tank and the like) required for electroform molding is omitted.
After the electroforming molding is completed, the removing step is performed to remove the molding guide wall 70A from the first member 60.
The removal step will be specifically described.
[0130] First, as illustrated in FIG. 22, after the preparation of a second support substrate 85 in which the adhesive layer 85B is formed on the main substrate body 85A, the semi-finished part 75 which is detached from the first support substrate 80 is turned over again. Then, in the silicon substrate 70, a surface on a side opposite a side where the silicon oxide film 71 is formed is laminated to the adhesive layer 85B.
Then, as illustrated in FIG. 23, only the molding guide wall 70A is selectively removed from the semi-finished part 75. Specifically, in the semi-finished part 75, an area other than the molding guide wall 70A is covered with a mask ( not shown) from above for example, and the non-masked molding guide wall 70A is removed by the etching operation performed by dry etching such as deep reactive ion etching (DRIE).
At this stage, the deletion step ends.
Then, as illustrated in FIG. 24, after the second support substrate 85 is detached, as shown in Figures 25 and 26, the remaining silicon oxide film 71 is removed by wet etching using BHF for example.
The silicon oxide film 71 does not need to be deleted, but it is preferably deleted. In addition, in Figs. 25 and 26, since the film thickness of the silicon oxide film 71 is exaggerated in the drawing, a step difference is generated between the first member 60 and the second member 61. However, the amount of the step difference is insignificant (e.g., approximately 1 μm), being in this manner substantially equivalent by not having the step difference between the first member 60 and the second member 61 as illustrated in FIG. . 3.
Then, finally, the weight 65 is fixed to be in the weight hole 62 by the tight fit, and therefore, it is possible to manufacture the balance wheel 42 shown in FIG. 2.
Hereinafter, as previously described, the balance shaft 41 and the spiral spring 43 which are manufactured separately are assembled to be integrated with the rocker wheel 42, thereby completing the manufacture of the rocker 40.
Actuation Effect As described above, according to the pendulum 40 of the embodiment, the first element 60 of the bi-material portion 50 is formed of silicon thereby preventing the bi-material portion 50 from being elastically deformed. Even if the deformation of the free end 50B is repeated due to the temperature correction, it is possible to form the bi-material portion 50 with stable time-dependent accuracy.
In addition, in the bi-material portion 50 configured to include the first member 60 and the second member 61 which overlap radially with each other, since the first inward member 60 is formed of silicon the thermal deformation of the first element 60 caused by the temperature change is suppressed, and thus the deformation of the bi-material part 50 which is associated with the temperature change is suppressed to be low, and it is possible to obtain a desired amount of adjustment in the moment of inertia. In other words, since the element towards the inside of the bi-material part 50 is made of silicon, it is possible to design a deformation volume of the free end 50B of the bi-material part 50 without considering excessively the volume of thermal deformation of the element inwards. Therefore, the temperature correction with the moment of inertia can be performed easily, thereby allowing a correction accuracy to be improved.
In addition, by providing a range of adjustment of the desired moment of inertia, since the deformation volume of the free end 50B of the bi-material part 50 can be reduced, an opening (space interposed by the part bi-material 50 and the connecting element 51 between them) surrounding the free end 50B can be reduced, thereby allowing the rocker 40 to be formed with a high density.
Accordingly, it is possible to provide a desired rigidity in the pendulum which is formed of silicon.
In addition, since the bi-material portion 50 highly dense is formed only on the extrinsic periphery, it is possible to reduce the total weight and obtain the desired moment of inertia. In other words, the silicon is used to reduce the weight of the balance 40, and therefore, it is possible to reduce a shock applied to the balance shaft 41 when the timepiece is decreased. As a result, the amount of occurrence in the bend of the balance shaft or the breakage of the balance shaft is eliminated, and it is possible to improve the reliability as a timepiece.
In addition, in the rocker wheel 42, the connection element 51 and the first element 60 are formed of silicon to be integrated with each other, it is possible to form the connection element 51 and the first member 60 to integrate with each other with excellent shape accuracy from the silicon substrate 70, using semiconductor manufacturing technology (including photolithography and etch processing technology technology). ). In addition, the use of semiconductor manufacturing technology allows the connection element 51 and the first element 60 to be formed into a desired minute shape without applying unnecessary external force thereto.
In the meantime, the second element 61 configuring the bi-material part 50 is the electroformed part, being able in this way to be linked to the first element 60 by easy work of depositing only the gold by the electroforming molding. Therefore, unlike a brazing or crimping process in the prior art, again without applying unnecessary external force to the first member 60, the second member 61 may be connected thereto. Therefore, in addition to preventing elastic deformation of the bi-material portion 50, it is possible to form the bi-material portion 50 with excellent shape accuracy. In addition, the silicon is not likely to be elastically deformed. On this point also, it is possible to prevent elastic deformation of the bi-material part 50.
As described above, since the bi-material portion 50 can be formed with excellent shape accuracy by preventing elastic deformation, the temperature correction work can be stably performed as intended, and thus, it is possible to provide a high quality balance 40 which is not likely to vary in the amount influenced by the temperature change and which is excellent in terms of temperature compensation capability.
In addition, the shape of the bi-material portion 50 can be adjusted, thereby allowing a degree of freedom in the shape of the bi-material portion 50 to be improved. For example, the volume of the temperature compensation can be adjusted by increasing the displacement.
Furthermore, during the manufacture of the rocker wheel 42, in addition to the connection element 51 and the first element 60, the semi-finished part 75 is formed to which the molding guide wall 70A is formed. to be integrated with. Therefore, the open molding space S defined between the molding guide wall 70A and the first member 60 can be formed with excellent shape accuracy. Then, at the time of electroforming molding, the second member 61 is formed by growing the gold in the open molding space S, thereby allowing the second member 61 to be formed with excellent shape accuracy. As a result, it is possible to obtain the bi-material part 50 of high quality having the desired shape.
In this way, it is possible to more clearly expose the actuation described above.
In addition, the connection element 51 and the first element 60 are made of silicon, not being in this way not likely to rust, even if a plating is not carried out. In addition, the second member 61 is formed of gold, thereby being an excellent rust prevention. According to this, there is no need for a plating step, thereby allowing efficient manufacture.
In addition, since the first element 60 and the second element 61 configuring the bi-material part 50 are engaged with each other by the joining of the corner 67 and the concave portion 68 also, the intensity of Link between them can be improved, thereby allowing operational reliability such as bi-material portion 50 to be improved. In addition, the connection between it determines a position of the second element 61 in the circumferential direction with respect to the first element 60, and therefore the second element 61 can be connected to the zone led by the first element 60. Also on this point, it is possible to improve the operational reliability as the bi-material part 50.
The movement 10 according to the embodiment is provided with the temperature compensation balance 40 described above having the high temperature compensation capability, and therefore, it is possible to provide a high quality movement having little errors affecting the frequency.
Furthermore, according to the mechanical timepiece 1 of the embodiment which is provided with the movement 10, it is possible to provide a high quality timepiece having few errors affecting the frequency.
Modification Example [0152] In the embodiment, although the flyweight 65 is provided at the free end 50B of the bi-material portion 50, the flyweight 65 is not mandatory and may be omitted. However, since the weight of the free end 50B can be increased by providing the flyweight 65, the temperature correction with the moment of inertia can be performed more efficiently with respect to the amount of change of the free end 50B in the radial direction, and therefore, it is likely to be improved with respect to the temperature compensation capability.
A shape of the flyweight 65 may be determined by the weight of the flyweight 65 and the amount of the moment of inertia that is required for the flyweight 65.
In addition, by providing the flyweight 65, the flyweight 65 is not limited to that which is fixed to be in the weight hole 62 as in the embodiment by the snug fit and can be changed so free.
For example, as illustrated in FIG. 27, an electroformed portion in which the gold accumulates in the weight hole 62 by the electroforming molding can be provided as a feeder 90.
In this case, a part of the adhesion layer 85B is removed at the time of manufacture, and when the electrode layer 80B is exposed to the open molding space S, the adhesion layer 85B the portion corresponding to the weight 62 is removed simultaneously with the exposure of the electrode layer 80B. Then, during the formation of the second gold element 61 by electroforming molding, the flyweight 90 can be formed by simultaneously depositing the gold in the weight hole 62.
In this way, the second element 61 and the flyweight 90 can be formed simultaneously by an electroforming molding step, and thus, it is possible furthermore to improve the manufacturing efficiency. In addition, it is possible to form the flyweight 90 without applying the external force to the free end 50B of the bi-material portion 50, thus being more preferable.
In addition, in the above embodiment, although a case is described in which the corner portions 67 provided on both ends of the second element 61 in the circumferential direction are in a state of being engaged. with the concave portion 68 on the first member side 60, and the first member 60 and the second member 61 are bonded to each other, the securing of the wedge 67 and the concave portion 68 is not mandatory and can to be omitted. However, since the fastening improves the bonding intensity and allows the second element 61 to be regulated so as not to remove the first element 60 and to be displaced neither radially nor circumferentially relative to the first element 60, it is preferable to to provide for solidarity between them.
Instead of the corner 67 and the concave part 68, a different securing element may be provided for the first element 60 and the second element 61, or instead of the corner 67 and the concave part 68, a different securing element can be added to the first element 60 and the second element 61.
For example, as illustrated in FIGS. 28 and 29, two concave securing portions (first securing portion) 91 that are radially open outward on the outer peripheral portion of the first member 60 may be provided spaced apart. with an interval in the circumferential direction, and two convex securing portions (second securing portion) 92 which protrude radially inwards on the inner periphery portion of the second member 61 and engage with the concave securing portion 91 may be provided by being spaced apart with an interval in the circumferential direction.
In this way, it is possible to improve the intensity of connection between the first element 60 and the second element 61 by additionally adding concave securing portions 91 and convex securing portions 92, being in this way more preferable. The number of concave securing portions 91 and convex securing portions 92 is not limited to two.
In addition, as illustrated in FIGS. 30 and 31, the first element 60 and the second element 61 may be bonded to one another by an alloy layer 95.
When forming the alloy layer 95, after the second element 61 is formed by the electroforming molding step, a heat treatment step is performed, wherein the semi-finished part 75 having the Bi-material portion 50 formed therein is heat-treated for a predetermined period of time at a predetermined temperature atmosphere. It is possible to deposit the gold forming the second element 61 which is the electroformed part along a connection interface with respect to the first element 60 by carrying out the heat treatment in such a way, and therefore, it is possible to forming the alloy layer 95 between the first member 60 and the second member 61 using this deposit.
Even in this case, it is also possible to improve the connection intensity between the first element 60 and the second element 61. Therefore, it is possible to improve the operational reliability as the bi-material part 50 .
At the time of being performed, the heat treatment can be performed at any time as long as it is after the electroforming molding step. The heat treatment may be performed prior to removal of the molding guide wall 70A or may be effected after removal thereof. However, since the alloy layer 95 is also formed between the molding guide wall 70A and the second element 61 by the heat treatment, it is preferable that the heat treatment be performed after the removal of the molding guide wall 70A. .
In addition, in the case of the embodiment described above, since the first element 60 is made of silicon and the second element 61 is made of gold, it is possible to perform the heat treatment at a temperature of temperature of about 1000 ° C. In addition, the heat treatment can also be carried out in the atmosphere. However, in order to prevent oxidation, it is preferable to carry out the heat treatment under vacuum, in argon gas or in nitrogen.
A technical field of the invention is not limited to the embodiment described above, and various modifications can be added thereto without departing from the scope of the invention.
For example, in the embodiment described above, there are three bi-material portions 50. However, their number may be two or may be greater than four. Even in these cases, it is possible to achieve the similar actuating effect by similarly arranging each of the bi-material portions 50 in the circumferential direction. In addition, one form of the connection member 51 is only one example and can be appropriately modified.
In addition, in the embodiment described above, a constant elastic material such as Elinvar as the material of the spiral spring 43 may be used, and the second element 61 in the bi-material portion 50 may be formed of a metal having a coefficient of thermal expansion lower than the first element 60 formed of the ceramic material. Even in this case, it is also possible to carefully adjust the temperature characteristics of the moment of inertia as well as to cancel the positive temperature coefficient of the spiral spring 43.
In addition, in the embodiment described above, the silicon is used to form the connecting element 51 and the first element 60 configuring the rocker wheel 42. However, the material is not limited to silicon.
For example, such as ceramic, silicon carbide (SiC), silicon dioxide (SiO2), sapphire, alumina (Al2O3), zirconia (ZrO2), vitreous carbon (C) and the like can be used. Even if one of these is used, it is possible to perform the etching treatment, particularly, preferably to perform the dry etching treatment. Therefore, it is possible to form more easily and more effectively the connection member 51 and the first member 60, and therefore, it is also likely to improve the manufacturing efficiency. In addition, for example, the first member 60 may be formed of a metal other than the ceramic material. For example, an alloy having a high coefficient of thermal expansion such as Invar can be used.
It is preferred that the ceramic material in the embodiment has an insulation property with high electrical resistance. In addition, on the front surface of the connecting member 51 and the first member 60, a coating film such as an oxide film or a nitride film can be processed, for example.
In addition, the gold is used to form the second element 61 configuring the balance wheel 42. However, the material is not limited to gold as long as the second element 61 has a coefficient of thermal expansion. different (preferably wider) than that of the first member 60 and is a metal which may be subject to electroform molding.
For example, Au, Ni, a Ni alloy (such as Ni-Fe), Sn, an Sn alloy (such as Sn-Cu) and the like can be employed. Even if one of these elements is employed, it is possible to gently grow the metal by electroform molding, thereby allowing the second member 61 to be formed effectively. In addition, for example, the second member 61 may be a material having a higher coefficient of thermal expansion than the metal and alloy described above. For example, stainless steel, brass and the like having a coefficient of thermal expansion higher than the Invar described above can be used.
In particular, even if one of these metal materials described above is employed, it is possible to form the alloy layer 95 by the heat treatment. In such a case, silicon (Si) and silicon carbide (SiC) are particularly preferable to be combined as the ceramic material for the side of first member 60.
In a case having the combination described above, FIG. 32 represents preferable heat treatment temperatures at the time of the heat treatment step. It is possible to form the alloy layer 95 which is sufficient to improve the bonding intensity by effecting the heat treatment at the process heat temperatures shown in FIG. 32.
In the embodiment, although the flyweight 65 is provided at the free end 50B of the bi-material portion 50, the flyweight 65 is not mandatory and can be omitted. However, since the weight of the free end 50B can be increased by providing the flyweight 65, the temperature correction with the moment of inertia can be effected more efficiently with respect to the amount of change in a radius of the free end. 50B, and therefore, it is likely to be improved in the temperature compensation capability.
A shape of the flyweight 65 may be determined by the weight of the weight 65 and the volume of the moment of inertia which is required for the flyweight 65.
In addition, when creating the flyweight 65, the flyweight 65 is not limited to that set to be in the weight hole 62 as in the embodiment by the tight fit and can be changed from free way. For example, an electroformed portion made of gold deposited in the weight hole 62 by electroforming molding can be provided as a feeder.
In addition, in the embodiment, the configuration is described in which the first member 60 and the second member 61 gradually become thinner as the fixed end side 50A toward the free end side 50B. However, without being limited to this, it is applicable as long as the total thickness of the bi-material portion 50 gradually becomes thinner as being from the fixed end side 50A to the free end side 50B. That is, at least only one of the first and second members 60 and 61 (preferably the first member 60) can be formed to be gradually thinner as being from the fixed end side 50A toward the free end side 50B in the configuration.
Moreover, the first element 60 and the second element 61 may be equal to one another in thickness, or only one may be thicker than the other. However, it is preferable to incite the material with the Young's modulus high to be finer, between the first element 60 and the second element 61.
In addition, in the embodiment described above, a case is described wherein the thickness ratio of the first member 60 to the second member 61 is uniformly adjusted throughout the bi-material portion 50 in the circumferential direction. However, without being limited thereto, it can be set to cause the thickness ratio to change along the circumferential direction.
In addition, when the first element 60 is formed of a metal having the low coefficient of thermal expansion such as Invar, other than the ceramic material, and the second element 61 is formed of stainless steel, the brass or similar having the large coefficient of thermal expansion, it is possible to form external forms thereof by machining, etching, laser machining and the like. In addition, the first member 60 and the second member 61 may be formed separately, and the first member 60 and the second member 61 may be bonded by fit, glue, weld or the like.
As described above, it is possible to create a temperature compensated balance that first ensures an intensity and can ensure the amount of temperature correction required of the moment of inertia, a timepiece movement. which is provided with the same and a mechanical timepiece.
In addition, within a range without departing from the scope of the invention, it is possible to appropriately replace the configuration elements in the embodiment described above with well-known configuration elements, and each of the Examples of modification described above can be combined appropriately.

权利要求:
Claims (14)
[1]
claims
A temperature compensated rocker comprising: a rocker shaft (41) which rotates about an axis of rotation (O); and a rocker wheel (42) having a plurality of bi-material portions (50) which are subsequently disposed in a circumferential direction about the axis of rotation (O) and which extend in an arcuate shape along the circumferential direction about the axis of rotation (O) and the disconnecting elements (51) which radially connect each of the bi-material portions (50) to the rocker shaft (41), wherein the bi-material portion (50) material (50) is a multilayer body of which a first element (60) and a second element (61), radially more outwardly than the first element (60), overlap each other radially, one end of which circumferential direction is a fixed end (50A) connected to the connecting member (51) and whose other end in the circumferential direction is a free end (50B), the first member (60) is made of a material selected from a ceramic , silicon (Si), silicon carbide (SiC), silicon dioxide (SiO2), sapphire, alumina (Al2O3), zirconia (ZrO2), vitreous carbon (C) and a metal especially invar, and the second element (61) is made of a metal having a coefficient of thermal expansion different from that of the material of the first element (60).
[2]
A temperature compensated rocker according to claim 1, wherein the first member (60) and the connecting member (51) are integral with one another made of ceramic or silicon, and the second member (61) is an electroformed portion made of metal having the thermal expansion coefficient different from that of the material of the first member (60).
[3]
3. temperature compensated balance according to claim 1 or 2, wherein the second member (61) has a second securing portion (92) which is secured to a first securing portion (91) formed in the first member (60). , one of the first and second securing parts (91, 92) penetrating into the other securing part among these first and second securing parts (91, 92) so as to reinforce the connection between the first and second elements ( 60, 61).
[4]
The temperature compensated rocker according to claim 1 or 2, wherein the first member (60) and the second member (61) are bonded by means of an alloy layer (95).
[5]
A temperature compensation balance according to one of claims 1 to 4, wherein the first member (60) and the connecting member (51) are made of a material selected from Si, SiC, SiO 2, Al 2 O 3, ZrO 2. and C.
[6]
6. temperature compensated balance according to one of claims 1 to 5, wherein the second element (61) is made of a material selected from Au, Cu, Ni, an alloy of Ni, Sn and Sn alloy.
[7]
A temperature compensated balance wheel according to one of claims 1 to 6, wherein the bi-material portion (50) gradually becomes thinner in thickness along the radial direction from the fixed end region to the region. free end.
[8]
The temperature compensated rocker according to claim 7, wherein the first member (60) is radially more inward than the second member (61) and is integral with the connecting member (51). being made of ceramic or silicon, and at least the first element (60) among the first element (60) and the second element (61) gradually becomes finer in thickness along the radial direction from the region of fixed end to the free end region.
[9]
The temperature compensated rocker according to claim 7 or 8, wherein the ratio of the thickness of the first member (60) in the radial direction to the thickness of the second member (61) in the radial direction is constant from the region. fixed end to the free end region.
[10]
10. A temperature compensation balance according to one of claims 1 to 4 and 7 to 9, wherein a flyweight (65) is provided at the free end (50B) of the bi-material portion (50).
[11]
A timepiece movement comprising: a movement barrel (22) that includes a power source; a work wheel that transfers a rotational force of the movement barrel (22); an exhaust mechanism (30) which controls the rotations of the wheel of the wheel; and a regulating mechanism (31) for adjusting the rate of the exhaust mechanism (30), said regulating mechanism (31) having a temperature compensating balance (40) according to claim 1.
[12]
Mechanical timepiece comprising: the timepiece movement (10) according to claim 11.
[13]
The method of manufacturing the temperature compensated balance (40) according to claim 1, comprising: an etching step which is performed in a substrate made of a material selected from a ceramic, silicon (Si), silicon carbide ( SiC), silicon dioxide (SiO2), sapphire, alumina (Al2O3), zirconia (ZrO2) and vitreous carbon (C), and in which, by etching after photolithography of the mask, semi-finished part (75) is manufactured from the substrate to include the first members (60), the connecting members (51) and a molding guide wall (70A) and such that the first members (60) ) are connected to the connection elements (51), that the molding guide wall (70A) and one of the first elements (60) delimit between them an open molding space (S) and that the molding guide wall (70A) is connected to this first element (60); an electroforming molding step in which a metal accumulates in the open mold space (S) on the semi-finished part (75) by electroforming to form the second member (61) and so that the bi-material part (50) is obtained in which the first element (60) and the second element (61) overlap in radially succeeding succession and are bonded together; and a suppressing step wherein the molding guide wall (70A) is removed from the first member (60).
[14]
The method of manufacturing the temperature compensating balance (40) according to claim 13, further comprising: a heat treatment step wherein the semi-finished part (75) having the bi-material portion (50) formed therein is heat-treated for a predetermined time in a predetermined temperature environment, after the electroforming molding step.

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同族专利:

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US20140241134A1|2014-08-28|

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CN104007650A|2014-08-27|

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CN107505826A|2017-12-22|

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CH707630A2|2014-08-29|

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CN107505826B|2020-06-30|

引用文献:

---

公开号 | 申请日 | 公开日 | 申请人 | 专利标题

---

---

US203976A|1878-04-16|1878-05-21|Improvement in compensation-balances |

---

US487550A|1891-02-06|1892-12-06|Non-magnetic watch-balance |

---

US489790A|1892-02-29|1893-01-10|Non-magnetic watch-balance |

---

US965506A|1908-10-22|1910-07-26|Frederic Ecaubert|Compensating balance for timepieces.|

---

US1176527A|1914-02-11|1916-03-21|Frederic Ecaubert|Compensating balance-wheel.|

---

US1859866A|1926-02-06|1932-05-24|Solvil Des Montres Paul Ditish|Regulating device for clockworks|

---

US2116257A|1935-11-21|1938-05-03|Aegler Hermann|Balance wheel|

---

US2232742A|1939-01-26|1941-02-25|Ralph E Thompson|Method of making compensating balance wheels and the like|

---

US2936572A|1957-08-12|1960-05-17|Hamilton Watch Co|Balance wheel for electric watch|

---

JP3496544B2|1998-04-17|2004-02-16|セイコーエプソン株式会社|Mainspring device and clock|

---

FR2842313B1|2002-07-12|2004-10-22|Gideon Levingston|MECHANICAL OSCILLATOR IN MATERIALS FOR REACHING A HIGHER LEVEL OF PRECISION, APPLIED TO A WATCHMAKING MOVEMENT OR OTHER PRECISION INSTRUMENT|

---

GB0324439D0|2003-10-20|2003-11-19|Levingston Gideon R|Minimal thermal variation and temperature compensating non-magnetic balance wheels and methods of production of these and their associated balance springs|

---

DE602005006858D1|2004-02-05|2008-07-03|Montres Breguet Sa|Balance for clockwork|

---

EP1805565B1|2004-10-26|2010-09-15|TAG Heuer SA|Wristwatch regulating member and mechanical movement comprising one such regulating member|

---

WO2008029158A2|2006-09-08|2008-03-13|Gideon Levingston|Thermally compensating balance wheel|

---

CH714952B1|2007-05-08|2019-10-31|Patek Philippe Sa Geneve|Watchmaking component, its method of manufacture and application of this method.|

---

EP2104008A1|2008-03-20|2009-09-23|Nivarox-FAR S.A.|Single-body regulating organ and method for manufacturing same|

---

EP2410387B1|2010-07-19|2016-07-06|Nivarox-FAR S.A.|balance wheel with inertia adjustment without insert|

---

JP2012063162A|2010-09-14|2012-03-29|Seiko Instruments Inc|Gear for clock and clock|JP2015143673A|2013-12-27|2015-08-06|セイコーインスツル株式会社|Balance with hairspring, movement, and timepiece|

---

US10274897B2|2015-06-15|2019-04-30|Citizen Watch Co., Ltd.|Speed governor for timepiece|

---

EP3106932A1|2015-06-16|2016-12-21|Nivarox-FAR S.A.|Manufacturing method comprising a modified mounting step|

---

EP3106930A1|2015-06-16|2016-12-21|Nivarox-FAR S.A.|Manufacturing method comprising a modified machining step|

---

WO2017064802A1|2015-10-16|2017-04-20|株式会社島津製作所|Method for correcting measurement error resulting from measurement device temperature displacement and mass spectrometer using said method|

---

CN105570344A|2016-02-19|2016-05-11|太仓钰丰机械工程有限公司|High-sensitivity temperature sensor for clutch|

---

CN105570343A|2016-02-19|2016-05-11|太仓钰丰机械工程有限公司|Firm-structure bimetallic strip for clutch|

---

EP3217228B1|2016-03-07|2019-08-28|Montres Breguet S.A.|Bimetal device sensitive to temperature changes|

---

EP3217229B1|2016-03-07|2020-01-01|Montres Breguet S.A.|Adjustable auxiliary thermal compensation system|

---

EP3252546B1|2016-06-03|2019-08-28|The Swatch Group Research and Development Ltd|Timepiece mechanism with balance wheel inertia adjustment|

---

CH713286B1|2016-12-23|2020-11-30|Mft Et Fabrique De Montres Et Chronometres Ulysse Nardin Le Locle S A|Balance wheel for mechanical clockwork movement.|

---

JP6789140B2|2017-01-31|2020-11-25|セイコーインスツル株式会社|Temperature-compensated balance, movement and watch|

---

CN106951597B|2017-02-24|2020-03-20|上海理工大学|Electric spindle thermal deformation compensation design method based on carbon fiber material thermal shrinkage|

---

CN106933098B|2017-02-24|2019-10-01|上海理工大学|Plate mechanical structure thermal distortion compensation design method|

---

US10677369B2|2017-08-03|2020-06-09|Fluke Corporation|Temperature calibration system comprising a valve in a closed fluidic system|

---

JP2019158844A|2018-03-16|2019-09-19|セイコーインスツル株式会社|Temperature compensating balance, movement, and watch|

---

EP3557335A1|2018-04-17|2019-10-23|Dominique Renaud SA|Free direct escapement mechanism for timepiece part|

---

EP3667433A1|2018-12-12|2020-06-17|Nivarox-FAR S.A.|Spring and method for manufacturing same|

---

CN110780137B|2019-11-07|2021-11-09|山东龙为检测技术有限公司|High-temperature-resistant testing device for electronic components|

法律状态:

优先权:

---

申请号 | 申请日 | 专利标题

---

JP2013034703A|JP6025202B2|2013-02-25|2013-02-25|Temperature compensated balance, watch movement, and mechanical watch|

---

JP2013034704A|JP6025203B2|2013-02-25|2013-02-25|Temperature-compensated balance, movement for watch, mechanical watch, and method for manufacturing temperature-compensated balance|

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